➀ AMD and the DOE announce two new supercomputers at ORNL; ➁ Lux, scheduled for 2026, is the first AI Factory supercomputer; ➂ Discovery, set for 2028, aims to enhance sovereign AI and scientific computing.
Recent #High-Performance Computing news in the semiconductor industry
➀ High-performance CPU design is transitioning from traditional Out-of-Order (OOO) architectures to Time-Based OOO, leveraging RISC-V's open ecosystem to improve power efficiency and scalability.
➁ Condor Computing's Cuzco processor uses a slice-based microarchitecture and predictive scheduling via a Time Resource Matrix, enabling flexible configurations for datacenter, mobile, and automotive applications.
➂ Key advantages include superior performance-per-watt, simplified verification, and ISA extensibility, positioning RISC-V as a competitive alternative to legacy architectures like x86 and ARM.
➀ Phison partners with Supermicro to address the increasing storage demands of AI and high-performance computing; ➁ Phison's Pascari D205V SSDs with 122.88 TB capacity are integrated into Supermicro's Petascale Storage servers; ➂ The collaboration aims to simplify data center infrastructure and replace traditional hard drives with faster solid-state storage.
1. TSMC's SoIC advanced packaging technology faces surging demand, with orders extending to 2027; 2. Major clients include Apple, NVIDIA, and AMD, driving capacity expansion plans; 3. The technology supports next-gen AI/HPC chips with 3D stacking innovation.
➀ AMD processors have helped achieve a new world record in a recent Ansys Fluent computational fluid dynamics (CFD) simulation on the Frontier supercomputer.
➁ The simulation, which tested Baker Hughes' next-generation gas turbines, was completed in 1.5 hours using 1,024 AMD Instinct MI250X accelerators and AMD EPYC CPUs.
➂ This marks a 25x speed increase compared to the previous 38.5-hour completion time on 3,700 CPU cores.
FMD has launched the Chiplet Application Hub, a central platform for chiplet technology development and application. The hub aims to bridge the gap between research and industry, accelerate the development of German-made chiplets, and reinforce Germany's technological resilience. It complements FMD's role in the Chips for Europe Initiative and builds on the APECS pilot line infrastructure.
The hub is designed to foster collaboration with industry partners, develop new chiplet solutions, and drive innovation in chiplet technologies. It is expected to enhance energy efficiency, performance, and the reusability of high-cost design components, particularly in the automotive and high-performance computing sectors.
➀ AI servers are expected to account for 70% of the server market in 2025, with a total value of $298 billion. ➁ AI server shipments are forecasted to grow by nearly 28% YoY in 2025. ➂ NVIDIA's Blackwell platform chips are set to be the main offerings for high-end GPUs by 2025.
➀ Silicon Creations achieves a significant milestone with over 1,000 licenses sold for its Fractional-N PLL IP; ➁ The technology offers versatile frequency synthesis capabilities, expanding its application potential; ➂ Deployed in various markets, the IP demonstrates adaptability across different applications.
➀ Sarcina Technology addresses the cost and complexity of 2.5D package design with Bump Pitch Transformers; ➁ BPT replaces expensive silicon TSV interposers with cost-effective RDLs; ➂ Sarcina's BPT aims to democratize 2.5D design for various applications like HPC and AI.
➀ TSMC reports a strong demand for 2nm nodes over 3nm, with A16 attracting AI server clients.
➁ TSMC's 3nm shipments accounted for 20% of total wafer revenue in Q3 2024.
➃ TSMC's 2nm is expected to enter volume production in 2025.
➄ TSMC plans to expand its 2nm capacity to meet strong demand.
➅ TSMC's A16 process is highly attractive for AI server applications.
➀ The need for RDMA in high-performance computing, big data storage, and machine learning domains;
➁ Detailed introduction of RDMA network architecture, key components, and protocols;
➂ Explanation of the RDMA working mechanism, including software configuration and hardware design;
➃ Overview of RDMA technology protocols such as InfiniBand, iWARP, and RoCE;
➄ Future technological innovations and challenges for RDMA, including scalable RDMA controllers, efficient QP management, congestion control, network topology optimization, and security.
➀ Associate Professor Julian Shun develops high-performance algorithms and frameworks for large-scale graph processing; ➁ His work focuses on finding the shortest path between objects in a network and detecting fraudulent transactions; ➂ Shun's algorithms leverage parallel computing to analyze massive graphs efficiently; ➃ He has developed user-friendly programming frameworks to facilitate efficient graph algorithm development; ➄ Shun's research includes clustering algorithms and dynamic graph algorithms for real-world applications.
➀ The Intel Xeon 6900P series, with 128 cores and 12 memory channels, marks Intel's return to server CPU leadership after trailing AMD for seven years; ➁ The series features new process technology and accelerators, aiming to compete with AMD's top-end parts; ➂ Intel's design strategy includes integrating memory controllers into compute tiles for better performance.
1. TSMC reported record revenue in Q2-2024, indicating the semiconductor industry is recovering from a downcycle. 2. The company introduced its Foundry 2.0 strategy, focusing on advanced packaging and 3D integration. 3. TSMC is transitioning from a components company to a subsystems company, aiming to control more of the supply chain.
1. The Gesellschaft für wissenschaftliche Datenverarbeitung mbH Göttingen (GWDG) announces the Scalable Storage Competition (SSC) in collaboration with the University of Göttingen. 2. The competition aims to enhance understanding and knowledge of storage solutions in various scenarios. 3. Participating teams will have access to real cluster hardware and will compete to optimize storage performance for different HPC applications.
1. The Gesellschaft für wissenschaftliche Datenverarbeitung mbH Göttingen (GWDG) and the University of Göttingen are hosting the Scalable Storage Competition (SSC) from summer 2024 to May 2025. 2. The competition aims to enhance understanding and capabilities in high-performance computing and storage solutions. 3. Participants will have access to a real cluster hardware to optimize storage solutions for various HPC scenarios.
1. Pure Storage benefits from secular trends like AI adoption and hybrid cloud architecture, driving demand for advanced storage solutions. 2. The company's innovative products, including flash memory and Storage-as-a-Service, position it as a leader in the storage market. 3. Despite competition, Pure Storage's growth potential and current valuation suggest it remains a compelling investment for aggressive growth investors.
1. TSMC reported over 40% YoY sales growth in 2Q24, exceeding expectations. 2. The majority of TSMC's net sales are from the high-performance computing industry, driven by demand for 5 nanometer chips. 3. TSMC's accelerating sales momentum and potential for record-breaking earnings make it an attractive investment opportunity.